Invention Grant
US07641839B2 Method for fabricating a three dimensional emblem 失效
制造三维标志的方法

  • Patent Title: Method for fabricating a three dimensional emblem
  • Patent Title (中): 制造三维标志的方法
  • Application No.: US11675695
    Application Date: 2007-02-16
  • Publication No.: US07641839B2
    Publication Date: 2010-01-05
  • Inventor: Ming-Yuan Wu
  • Applicant: Ming-Yuan Wu
  • Agency: Sinorica, LLC
  • Agent Ming Chow
  • Main IPC: B29C53/00
  • IPC: B29C53/00 B29C53/02
Method for fabricating a three dimensional emblem
Abstract:
A method for fabricating a three dimensional emblem is disclosed. An indentation is formed in the back surface of a piece of transparent material. Multiple colors are printed to form a pattern or emblem in the indentation. After printing, the indentation is filled with resin to make the back surface of the piece of transparent material flat. A second indentation is then formed in the filled indentation. When the front surface of the transparent material is viewed, the emblem appears as a three dimensional emblem. Since the emblem is under the front surface of the transparent material, the three dimensional emblem is protected and cannot be inadvertently dislodged from the transparent material.
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