Invention Grant
- Patent Title: Socket with bolt
- Patent Title (中): 带螺栓的插座
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Application No.: US12229822Application Date: 2008-08-26
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Publication No.: US07641497B2Publication Date: 2010-01-05
- Inventor: Cheng-Chi Yeh
- Applicant: Cheng-Chi Yeh
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd
- Current Assignee: Hon Hai Precision Ind. Co., Ltd
- Current Assignee Address: TW Taipei Hsien
- Agent Andrew C. Cheng; Wei Te Chung; Ming Chieh Chang
- Priority: CN200720045585.5 20070828
- Main IPC: H01R13/625
- IPC: H01R13/625

Abstract:
A socket, for electrically connecting an IC package and a printed circuit board, comprises a base received with a plurality of contacts, a stiffener surrounding the base and bolts mounting the socket to the printed circuit board. The stiffener has a horizontal plate, which has engaging holes by drawing, so the engaging hole has a sidewall extending beyond the horizontal plate to keep the bolt in the engaging hole of the stiffener.
Public/Granted literature
- US20090061654A1 Socket with bolt Public/Granted day:2009-03-05
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