Invention Grant
- Patent Title: Connecting configuration for flexible wired circuit board and electronic device
- Patent Title (中): 柔性布线电路板和电子设备的连接配置
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Application No.: US12010177Application Date: 2008-01-22
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Publication No.: US07641488B2Publication Date: 2010-01-05
- Inventor: Voon Yee Ho , Szu-Han Hu
- Applicant: Voon Yee Ho , Szu-Han Hu
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Akerman Senterfitt
- Agent Jean C. Edwards, Esq.
- Priority: JP2007-021958 20070131
- Main IPC: H01R3/00
- IPC: H01R3/00
Abstract:
A connecting configuration for a flexible wired circuit board includes a first terminal member, a second terminal member, and a flexible wired circuit board having a conductive pattern for electrically connecting the first terminal member and the second terminal member. The first terminal member and the second terminal member are provided such that at least one of the terminal members is linearly movable to be adjacent to and apart from the other terminal member. The flexible wired circuit board is provided to be wound or twisted in the middle of the moving direction.
Public/Granted literature
- US20080182435A1 Connecting configuration for flexible wired circuit board and electronic device Public/Granted day:2008-07-31
Information query
