Invention Grant
- Patent Title: Apparatus for chip removing machining
- Patent Title (中): 去屑加工装置
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Application No.: US10609489Application Date: 2003-07-01
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Publication No.: US07641423B2Publication Date: 2010-01-05
- Inventor: Mats Blücher , Jonas Boman , Thomas Eriksson , Jan-Olf Lundeqvist , Kaj Virtanen
- Applicant: Mats Blücher , Jonas Boman , Thomas Eriksson , Jan-Olf Lundeqvist , Kaj Virtanen
- Applicant Address: SE Fagersta
- Assignee: Seco Tools AB
- Current Assignee: Seco Tools AB
- Current Assignee Address: SE Fagersta
- Agency: Drinker Biddle & Reath LLP
- Priority: SE0202029 20020107; SE0203356 20021114
- Main IPC: B23B51/02
- IPC: B23B51/02 ; B23B51/06

Abstract:
A device for chip removing machining includes first and second parts coupled together, wherein one of the parts includes a cutting edge. A coupling between the first and second parts includes two interacting surfaces and a clamp for forcing the surfaces together. The surfaces are profiled with male and female members, respectively, that are intercoupled to establish a form locking of the first and second parts against each other. The first and second parts are provided with central holes for receiving the clamp. The male and female members are configured to define only a single position of intercoupling.
Public/Granted literature
- US20040057785A1 Apparatus for chip removing machining Public/Granted day:2004-03-25
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