Invention Grant
- Patent Title: Ball Joint
- Patent Title (中): 球接头
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Application No.: US11817059Application Date: 2006-02-23
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Publication No.: US07641413B2Publication Date: 2010-01-05
- Inventor: Kazuharu Shimazu , Takahiro Oda
- Applicant: Kazuharu Shimazu , Takahiro Oda
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Somic Ishikawa
- Current Assignee: Kabushiki Kaisha Somic Ishikawa
- Current Assignee Address: JP Tokyo
- Agency: Darby & Darby P.C.
- Priority: JP2005-095910 20050329
- International Application: PCT/JP2006/303229 WO 20060223
- International Announcement: WO2006/103849 WO 20061005
- Main IPC: F16C11/00
- IPC: F16C11/00

Abstract:
A ball joint is provided that when a load equal to or greater than a first predetermined value is applied in the axial direction of a ball stud, if a cushion seat is deformed by a predetermined amount, an opposing surface portion contacts a first load receiving portion of a ball seat, preventing the cushion seat from being deformed by a predetermined amount in the central axis direction. When a load equal to or greater than a second predetermined value greater than the first is applied in the axial direction of the ball stud, a second load receiving portion of the ball seatcontacts a bottom surface portion of an inner chamber of a socket, whereby an axial load onto the cushion seat is reduced, and the ball seat prevents the cushion seat from being deformed by a predetermined amount or more in the axial direction.
Public/Granted literature
- US20090010706A1 Ball Joint Public/Granted day:2009-01-08
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