Invention Grant
- Patent Title: Ink jet head circuit board, method of manufacturing the same and ink jet head using the same
- Patent Title (中): 喷墨头电路板,其制造方法和使用其的喷墨头
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Application No.: US11203130Application Date: 2005-08-15
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Publication No.: US07641316B2Publication Date: 2010-01-05
- Inventor: Toshiyasu Sakai , Teruo Ozaki , Kenji Ono , Ichiro Saito , Sakai Yokoyama , Satoshi Ibe , Kazuaki Shibata
- Applicant: Toshiyasu Sakai , Teruo Ozaki , Kenji Ono , Ichiro Saito , Sakai Yokoyama , Satoshi Ibe , Kazuaki Shibata
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2004-236607 20040816
- Main IPC: B41J2/05
- IPC: B41J2/05

Abstract:
An ink jet head circuit board is provided which has heaters to generate thermal energy for ink ejection as they are energized. This circuit board reduces areas of the heaters to achieve higher printing resolution and image quality. This board also prevents a degradation of thermal energy efficiency and reduces power consumption. The protective insulation layer for the electrode wire layer is formed of two layers and one of the two layers is removed from above the heater to improve the heat energy efficiency. The resistor layer is deposited over the electrode wire layer. The patterning for removing the protective insulation layer is done in a wider range than a gap of the electrode wire layer, the gap being used to form the heater. Further, by forming the electrode wires in two layers, a possible reduction in an effective bubble generation area of the heater can be prevented.
Public/Granted literature
- US20060033782A1 Ink jet head circuit board, method of manufacturing the same and ink jet head using the same Public/Granted day:2006-02-16
Information query
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