Invention Grant
- Patent Title: Method and apparatus for contactless interface on ICC supporting high speed interface
- Patent Title (中): ICC支持高速接口无接触接口的方法和装置
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Application No.: US11555622Application Date: 2006-11-01
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Publication No.: US07641123B2Publication Date: 2010-01-05
- Inventor: Jean-François Deprun , Paul Jolivet
- Applicant: Jean-François Deprun , Paul Jolivet
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: Lee, Hong, Deggerman, Kang & Waimey
- Main IPC: G06K19/06
- IPC: G06K19/06 ; G06K7/06

Abstract:
An integrated circuit card includes a plurality of electrical contacts; and a memory to store information, the memory being allowed to communicate with a processor via the plurality of electrical contacts. One set of electrical contacts are allowed to be allocated by the processor to support an operation in at least one mode depending on a presence of a certain protocol mode detected by the processor. The integrated circuit card is operable in various modes including both contactless and high speed protocols, a contactless only without the high speed protocol and the high speed protocol only without the contactless protocol.
Public/Granted literature
- US20070200003A1 METHOD AND APPARATUS FOR CONTACTLESS INTERFACE ON ICC SUPPORTING HIGH SPEED INTERFACE Public/Granted day:2007-08-30
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