Invention Grant
- Patent Title: Moveable arm assembly for a wire bonder
- Patent Title (中): 用于焊线机的可动臂组件
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Application No.: US11868584Application Date: 2007-10-08
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Publication No.: US07641097B2Publication Date: 2010-01-05
- Inventor: Beni Nachon , Joseph M. Martin , John Randolph Simon
- Applicant: Beni Nachon , Joseph M. Martin , John Randolph Simon
- Applicant Address: US PA Fort Washington
- Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee Address: US PA Fort Washington
- Agent Christopher M. Spletzer, Sr.
- Main IPC: B23K37/00
- IPC: B23K37/00
Abstract:
A wire bonding machine includes a moveable arm assembly and at least one component for a ball bonding operation of the wire bonding machine supported by the moveable arm assembly. The moveable arm assembly is configured to move between a ball bonding position and a wedge bonding position. When the moveable arm assembly is in the ball bonding position the at least one component for the ball bonding operation is in a predetermined position for use in the ball bonding operation.
Public/Granted literature
- US20080083815A1 MOVEABLE ARM ASSEMBLY FOR A WIRE BONDER Public/Granted day:2008-04-10
Information query
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