Invention Grant
- Patent Title: Vacuum processing apparatus
- Patent Title (中): 真空加工设备
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Application No.: US11068990Application Date: 2005-03-02
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Publication No.: US07641069B2Publication Date: 2010-01-05
- Inventor: Susumu Tauchi , Akitaka Makino
- Applicant: Susumu Tauchi , Akitaka Makino
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2004-263968 20040910
- Main IPC: B65D6/40
- IPC: B65D6/40 ; B65D43/20 ; B65D51/16 ; B65D43/12

Abstract:
The invention provides a highly reliable plasma processing apparatus having stable sealing performance. The vacuum processing apparatus comprises a vacuum vessel having its inside decompressed; an opening disposed in a wall of the vacuum vessel for communicating the inside with the outside thereof and through which a sample to be processed is taken in and out; a valve body 701 disposed outside the wall for airtightly sealing or opening the opening; and a drive unit for driving the valve body to carry out the sealing or opening operation, the drive unit comprising a first member 705 coupled to an actuator 702 that moves along a substantially linear first direction as a result of operation of the actuator, a second member 706 coupled to the first member 705 that moves along a substantially linear second direction that intersects with the first direction, and the valve body 701 coupled to the second member that seals the opening as a result of the movement of the second member.
Public/Granted literature
- US20060057008A1 Vacuum processing apparatus Public/Granted day:2006-03-16
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