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Invention Grant
US07640968B2 Heat dissipation device with a heat pipe 失效
散热装置带热管

Heat dissipation device with a heat pipe
Abstract:
A heat dissipation device includes a base (10), a heat radiator (40) mounted on the base (10), and two heat pipes (20) connecting the base (10) and the heat radiator (40). The base (10) has a bottom face adapted for contacting with a heat-generating electronic component. The heat pipes (20) each comprise an evaporating portion (22) embedded in the base (10) and a condensing portion (24) extending from an end of the evaporating portion (22). The heat radiator (40) comprises first and second fin assemblies (42, 44) each having two contacting faces (43, 45), the condensing portions (24) of the heat pipes (20) are sandwiched between the contacting faces (43, 45) by the first and second fin assemblies (42, 44), and an opening is enclosed by the first and second fin assemblies (42, 44) and receives an electric fan (50) therein.
Abstract(Chinese):

散热装置包括基座（10），安装在基座（10）上的散热器（40）和连接基座（10）和散热器（40）的两根热管（20）。 基座（10）具有适于与发热电子部件接触的底面。 热管（20）各自包括嵌入在基座（10）中的蒸发部分（22）和从蒸发部分（22）的端部延伸的冷凝部分（24）。 散热器（40）包括分别具有两个接触面（43,45）的第一和第二翅片组件（42,44），热管（20）的冷凝部分（24）夹在接触面 并且第一和第二翅片组件（42,44）封闭开口，并且在其中容纳电风扇（50）。

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