Invention Grant
- Patent Title: Electronic component embedded board and its manufacturing method
- Patent Title (中): 电子元件嵌入式电路板及其制造方法
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Application No.: US11519125Application Date: 2006-09-12
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Publication No.: US07640655B2Publication Date: 2010-01-05
- Inventor: Masahiro Sunohara
- Applicant: Masahiro Sunohara
- Applicant Address: JP Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP2005-264746 20050913
- Main IPC: H05K3/30
- IPC: H05K3/30
Abstract:
A second substrate 12 is provided above a first substrate 11, and an electronic component 13 is arranged between the first substrate 11 and the second substrate 12 so that between the first substrate 11 and the second substrate 12, the electronic component 13 is sealed and a photosensitive resin 14 having adhesion is provided to bond the first substrate 11 and the second substrate 12 to each other.
Public/Granted literature
- US20070056766A1 Electronic component embedded board and its manufacturing method Public/Granted day:2007-03-15
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