Invention Grant
- Patent Title: Decoupling capacitors for semiconductor devices
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Application No.: US17144300Application Date: 2021-01-08
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Publication No.: US12160986B2Publication Date: 2024-12-03
- Inventor: Sujeet Ayyapureddi
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786 ; H01L49/02 ; H10B12/00
Abstract:
Systems, methods and apparatus are provided for decoupling capacitors for an array of vertically stacked memory cells. Embodiments provide that the decoupling capacitors are electrically coupled to a power bus.
Public/Granted literature
- US20220223596A1 DECOUPLING CAPACITORS FOR SEMICONDUCTOR DEVICES Public/Granted day:2022-07-14
Information query
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