Invention Grant
- Patent Title: Multilayer structure and semiconductor device
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Application No.: US17575838Application Date: 2022-01-14
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Publication No.: US12159940B2Publication Date: 2024-12-03
- Inventor: Mitsuru Okigawa , Yasushi Higuchi , Yusuke Matsubara , Osamu Imafuji , Takashi Shinohe
- Applicant: FLOSFIA INC.
- Applicant Address: JP Kyoto
- Assignee: FLOSFIA INC.
- Current Assignee: FLOSFIA INC.
- Current Assignee Address: JP Kyoto
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2019-131461 20190716
- Main IPC: H01L29/872
- IPC: H01L29/872 ; H01L21/02 ; H01L29/04 ; H01L29/24 ; H01L29/47 ; H01L29/78 ; H01L29/786

Abstract:
Provided are a multilayer structure in which crystal defects due to stress concentration in a semiconductor layer caused by an insulator film are prevented and a semiconductor device using the multilayer structure, the multilayer structure and the semiconductor device that are particularly useful for power devices. A multilayer structure in which an insulator film is arranged on a part of a semiconductor film, wherein the semiconductor film has a corundum structure and contains a crystalline oxide semiconductor containing one or two or more metals selected from groups 9 and 13 of the periodic table, and wherein the insulator film has a taper angle of 20° or less.
Public/Granted literature
- US20220140145A1 MULTILAYER STRUCTURE AND SEMICONDUCTOR DEVICE Public/Granted day:2022-05-05
Information query
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