Invention Grant
- Patent Title: Semiconductor including active contact buried portions
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Application No.: US17552446Application Date: 2021-12-16
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Publication No.: US12159911B2Publication Date: 2024-12-03
- Inventor: Gyeom Kim , Jinbum Kim , Dongwoo Kim , Dongsuk Shin , Sangmoon Lee , Seung Hun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2021-0058085 20210504
- Main IPC: H01L29/41
- IPC: H01L29/41 ; H01L21/02 ; H01L27/092 ; H01L29/06 ; H01L29/40 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/78 ; H01L29/786

Abstract:
A semiconductor device includes a substrate including an active pattern, a channel pattern and a source/drain pattern on the active pattern, a gate electrode provided on the channel pattern and extended in a first direction, and an active contact coupled to the source/drain pattern. The active contact includes a buried portion buried in the source/drain pattern and a contact portion on the buried portion. The buried portion includes an expansion portion provided in a lower portion of the source/drain pattern and a vertical extension portion connecting the contact portion to the expansion portion.
Public/Granted literature
- US20220359678A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-11-10
Information query
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