Invention Grant
- Patent Title: Semiconductor package with front side and back side redistribution structures and fabricating method thereof
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Application No.: US18196590Application Date: 2023-05-12
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Publication No.: US12159823B2Publication Date: 2024-12-03
- Inventor: Michael Kelly , David Hiner , Ronald Huemoeller , Roger St. Amand
- Applicant: Amkor Technology Singapore Holding Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee: Amkor Technology Singapore Holding Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L21/683 ; H01L23/31 ; H01L25/07
Abstract:
A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.
Public/Granted literature
- US20230282560A1 SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF Public/Granted day:2023-09-07
Information query
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