Invention Grant
- Patent Title: Multilayer coil component
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Application No.: US17169255Application Date: 2021-02-05
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Publication No.: US12159750B2Publication Date: 2024-12-03
- Inventor: Ryouji Mizobata , Makoto Hiraki , Katsuhisa Imada , Morihiro Hamano
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2020-018918 20200206
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/28 ; H01F27/29 ; H01F41/04 ; H01F41/12

Abstract:
A method for producing a multilayer coil component includes preparing an insulating sheet; forming a resin paste layer on the insulating sheet by using a resin paste; forming a conductive paste layer by using a conductive paste, the conductive paste layer covering the resin paste layer and having a projecting portion at a portion where a second void portion is to be formed; forming an insulating paste layer on the insulating sheet by using an insulating paste such that at least part of an upper surface of the conductive paste layer is exposed; stacking the insulating sheets having the resin paste layer, the conductive paste layer, and the insulating paste layer formed thereon to form a multilayer compact that includes the conductive paste layers connected into a coil shape; and firing the multilayer compact.
Public/Granted literature
- US20210249189A1 MULTILAYER COIL COMPONENT Public/Granted day:2021-08-12
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