Invention Grant
- Patent Title: Electronic apparatus with spine component and thermally conductive member
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Application No.: US17943429Application Date: 2022-09-13
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Publication No.: US12158779B2Publication Date: 2024-12-03
- Inventor: Atsushi Ohyama , Yusuke Onoue , Takanori Hoshino
- Applicant: Lenovo (Singapore) Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: Lenovo (Singapore) Pte. Ltd.
- Current Assignee: Lenovo (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Osha Bergman Watanabe & Burton LLP
- Priority: JP2021-170283 20211018
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F1/20 ; G09F9/30

Abstract:
An electronic apparatus includes: a first chassis equipped with a substrate on which a processing device is mounted; a second chassis which is provided adjacently to the first chassis and equipped with a battery device; a hinge device that connects the first chassis and the second chassis in such a manner as to be rotatable relative to each other between a first posture in which the first chassis and the second chassis are stacked to overlap each other in a surface normal direction and a second posture in which the first chassis and the second chassis are arranged side by side in a direction perpendicular in the surface normal direction; a spine component which is made of a thermally conductive material.
Public/Granted literature
- US20230121174A1 ELECTRONIC APPARATUS Public/Granted day:2023-04-20
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