The present photosensitive resin composition includes a polymer (A) having a structural unit (a1) represented by a formula (a1), a structural unit (a2) represented by a formula (a2), and a structural unit (a3) represented by a formula (a3), and a photoacid generator (B). In the formulae (a1) to (a3), R12, R22, and R32 each independently represent an organic group having 1 to 10 carbon atoms; R21 represents a substituted or non-substituted alkyl group having 1 to 10 carbon atoms; R31 represents a hydrogen atom, a substituted or non-substituted alkyl group having 1 to 10 carbon atoms, or a halogen atom; R13 and R23 each independently represent an acid dissociable group; R33 represents a hydroxyaryl group; and l, m and n independently represent an integer from 0 to 10.