Invention Grant
- Patent Title: Semiconductor device, integrated circuit and method of manufacturing the same
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Application No.: US17462577Application Date: 2021-08-31
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Publication No.: US12114511B2Publication Date: 2024-10-08
- Inventor: Hui-Hsien Wei , Yen-Chung Ho , Chia-Jung Yu , Yong-Jie Wu , Pin-Cheng Hsu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT LAW
- Agent Anthony King
- Main IPC: H01L29/82
- IPC: H01L29/82 ; H10B61/00 ; H10N50/01 ; H10N50/10 ; H10N50/80

Abstract:
A semiconductor device, an integrated circuit, and a method of manufacturing the same are provided. The semiconductor device includes a substrate, a thin-film transistor (TFT) over the substrate, and a magnetoresistive random-access memory (MRAM) cell electrically coupled to the TFT. The TFT includes a gate electrode; a gate dielectric layer disposed over the gate electrode; source/drain electrodes disposed above the gate electrode; and an active layer disposed above the gate electrode. A protection layer is disposed between the TFT and the MRAM cell and electrically connects the MRAM cell to the TFT.
Public/Granted literature
- US20230063125A1 SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2023-03-02
Information query
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