Invention Grant
- Patent Title: Fabrication method of a memory and the memory
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Application No.: US17403809Application Date: 2021-08-16
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Publication No.: US12114482B2Publication Date: 2024-10-08
- Inventor: Kangshu Zhan , Jun Xia , Qiang Wan , Tao Liu , Sen Li
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN 2011622620.0 2020.12.30
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/265 ; H01L29/66 ; H01L29/786 ; H10B12/00

Abstract:
Embodiments provide a memory and a fabrication method thereof, and relates to the field of storage device technology to solve the technical problem of lower storage density of the memory. The fabrication method of the memory includes: providing a substrate including a central region and an edge region connected to each other, a first contact structure electrically connected to a wordline structure in the substrate being formed in the edge region; forming a second contact structure electrically connected to the first contact structure on the edge region; forming a capacitor structure electrically connected to the wordline structure on the central region; forming a third contact structure electrically connected to the second contact structure on the second contact structure; and forming a transistor structure electrically connected to the wordline structure on the capacitor structure and the third contact structure.
Public/Granted literature
- US20220208764A1 MEMORY AND FABRICATION METHOD THEREOF Public/Granted day:2022-06-30
Information query
IPC分类: