Invention Grant
- Patent Title: Housing for electronic components
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Application No.: US17773806Application Date: 2020-10-19
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Publication No.: US12114439B2Publication Date: 2024-10-08
- Inventor: Felix Loske , Markus Friesen , Christian Vollmer , Uwe Graeff
- Applicant: HARTING ELECTRIC STIFTUNG & CO. KG
- Applicant Address: DE Espelkamp
- Assignee: HARTING ELECTRIC STIFTUNG & CO. KG
- Current Assignee: HARTING ELECTRIC STIFTUNG & CO. KG
- Current Assignee Address: DE
- Agency: HAYES SOLOWAY P.C.
- Priority: DE 2019129448.7 2019.10.31
- International Application: PCT/DE2020/100899 2020.10.19
- International Announcement: WO2021/083455A 2021.05.06
- Date entered country: 2022-05-02
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H01R12/71 ; H05K5/02

Abstract:
A system includes a housing of a printed circuit board arranged in the housing and at least one functional element, wherein the housing has at least one exchangeable side surface, wherein openings which correlate to electrical connections of the printed circuit board are provided in the at least one exchangeable side surface, and wherein the functional elements each pass through an opening in the side surface to the electrical connections of the printed circuit board assigned to them and are connected to said connections.
Public/Granted literature
- US20220418121A1 HOUSING FOR ELECTRONIC COMPONENTS Public/Granted day:2022-12-29
Information query