Invention Grant
- Patent Title: Electronic component module comprising shield and sealing resin covering electronic components
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Application No.: US17655376Application Date: 2022-03-18
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Publication No.: US12113030B2Publication Date: 2024-10-08
- Inventor: Tadashi Nomura , Yoshihito Otsubo
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto-fu
- Agency: Pearne & Gordon LLP
- Priority: JP 19177512 2019.09.27
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/13 ; H01L23/498 ; H01L25/16 ; H01L25/18 ; H01Q1/38
Abstract:
A module substrate, a sealing resin portion, and a shield are provided. The shield is provided to cover each of the sealing resin portion and a peripheral side surface of the module substrate. The shield is connected to a ground electrode. On the peripheral side surface, the shield is separated into a first surface side and a second surface side.
Public/Granted literature
- US20220208690A1 ELECTRONIC COMPONENT MODULE Public/Granted day:2022-06-30
Information query
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