Invention Grant
- Patent Title: Integrated circuit
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Application No.: US17236215Application Date: 2021-04-21
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Publication No.: US12112875B2Publication Date: 2024-10-08
- Inventor: Hsiao-Tsung Yen , Ka-Un Chan
- Applicant: Realtek Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: TW 9118142 2020.05.29
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/00 ; H01F27/29 ; H01L49/02

Abstract:
An integrated circuit includes a first coil and a second coil. The first coil is disposed on the first side of the integrated circuit. The second coil is disposed on the second side of the integrated circuit, and is partially overlapped with the first coil at a junction. The first coil is not interlaced with the second coil at the junction.
Public/Granted literature
- US20210375520A1 INTEGRATED CIRCUIT Public/Granted day:2021-12-02
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