Invention Grant
- Patent Title: Modular active valve system having a reduced footprint for use in a smaller shock platform
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Application No.: US17071750Application Date: 2020-10-15
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Publication No.: US12110943B2Publication Date: 2024-10-08
- Inventor: Connor Randall
- Applicant: Fox Factory, Inc.
- Applicant Address: US GA Duluth
- Assignee: Fox Factory, Inc.
- Current Assignee: Fox Factory, Inc.
- Current Assignee Address: US GA Duluth
- Main IPC: F16K31/122
- IPC: F16K31/122 ; F16F9/19 ; F16F9/34 ; F16F9/50 ; F16K31/40 ; B60G13/08 ; B60G17/08
Abstract:
A modular active valve system having a reduced footprint for use in a smaller shock platform is disclosed. The modular active valve system includes a multi-stage valve having a first stage and at least a second stage, wherein at least the first stage includes a semi-active valve for electronic damping control.
Public/Granted literature
- US20210108696A1 MODULAR ACTIVE VALVE SYSTEM HAVING A REDUCED FOOTPRINT FOR USE IN A SMALLER SHOCK PLATFORM Public/Granted day:2021-04-15
Information query
