Invention Grant
- Patent Title: Heat-curable resin composition
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Application No.: US17869197Application Date: 2022-07-20
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Publication No.: US12110356B2Publication Date: 2024-10-08
- Inventor: Naoyuki Kushihara , Rina Sasahara
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP 21126422 2021.08.02
- Main IPC: C08F283/10
- IPC: C08F283/10 ; C09D151/08 ; C09J151/08
Abstract:
Provided is a heat-curable resin composition capable of being turned into a cured product having a low relative permittivity, a low dielectric tangent, an excellent adhesiveness and a high resistance. The heat-curable resin composition contains:
(A) a citraconimide compound;
(B) an epoxy resin;
(C) an epoxy resin curing agent; and
(D) a curing accelerator.
(A) a citraconimide compound;
(B) an epoxy resin;
(C) an epoxy resin curing agent; and
(D) a curing accelerator.
Public/Granted literature
- US20230067259A1 HEAT-CURABLE RESIN COMPOSITION Public/Granted day:2023-03-02
Information query
