Invention Grant
- Patent Title: Process for recovering heat at high temperatures in plasma reforming systems
-
Application No.: US17276563Application Date: 2019-09-26
-
Publication No.: US12110229B2Publication Date: 2024-10-08
- Inventor: Leslie Bromberg , Kim-Chinh Tran , Jorj Ian Owen
- Applicant: MAAT Energy Company
- Applicant Address: US MA Cambridge
- Assignee: MAAT Energy Company
- Current Assignee: MAAT Energy Company
- Current Assignee Address: US MA Cambridge
- Agency: NIELDS, LEMACK & FRAME, LLC
- International Application: PCT/US2019/053177 2019.09.26
- International Announcement: WO2020/069146A 2020.04.02
- Date entered country: 2021-03-16
- Main IPC: C01B3/34
- IPC: C01B3/34 ; B01J8/04 ; C01B3/40 ; F28D17/02 ; F28D17/04 ; F28D20/02 ; F28D21/00
Abstract:
A heat recovery system for plasma reformers is comprised of a cascade of regenerators and recuperators that are arranged to transfer in stages the heat at high temperatures for storage, transport, and recirculation. Recirculation of heat increases the efficiency of plasma reformers and heat exchanging reduces temperature of the product for downstream applications.
Information query
