Invention Grant
- Patent Title: Heater assembly and bonding head including same
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Application No.: US17531798Application Date: 2021-11-21
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Publication No.: US12082313B2Publication Date: 2024-09-03
- Inventor: Soon Hyun Kim , Byung Geun Kim , Byoung Chan Lee
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Cheonan-si
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Cheonan-si
- Priority: KR 20200164525 2020.11.30
- Main IPC: H01L21/67
- IPC: H01L21/67 ; F28D21/00 ; H01L21/683 ; H05B1/02 ; H05B3/06
Abstract:
A heater assembly includes a housing having an accommodation space therein and having a cooling gas inlet communicating with the accommodation space, a heater coupled to the housing, and a porous block disposed in the accommodation space.
Public/Granted literature
- US20220174786A1 HEATER ASSEMBLY AND BONDING HEAD INCLUDING SAME Public/Granted day:2022-06-02
Information query
IPC分类:
