Invention Grant
- Patent Title: Liquid cooling device for the arrangement of a power semiconductor device
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Application No.: US17881929Application Date: 2022-08-05
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Publication No.: US12035514B2Publication Date: 2024-07-09
- Inventor: Harald Kobolla , Rainer Popp , Christian Zeller
- Applicant: SEMIKRON ELEKTRONIK GMBH & CO. KG
- Applicant Address: DE Nuremberg
- Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KG
- Current Assignee: SEMIKRON ELEKTRONIK GMBH & CO. KG
- Current Assignee Address: DE Nuremberg
- Agency: NOLTE LACKENBACH SIEGEL
- Agent Andrew F. Young
- Priority: DE 2021120529.8 2021.08.06
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A liquid cooling device with a main body has a planar surface for the arrangement of a power semiconductor device. This main body has a first end face and a second end face opposite said first one, and a plurality of tubular cooling recesses extending from the first to the second end face. A first swirling element arranged in an associated cooling recess, wherein the swirling element has an operative section arranged within the associated cooling recess and a locking section, wherein the locking section interacts with a locking abutment and/or with a further swirling element, and therefore prevents rotation of the operative section in the associated recess.
Public/Granted literature
- US20230038316A1 LIQUID COOLING DEVICE FOR THE ARRANGEMENT OF A POWER SEMICONDUCTOR DEVICE Public/Granted day:2023-02-09
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