An electronics module (100), especially a power electronics module, comprising



a metal-ceramic substrate (1) serving as a carrier and having a ceramic element (10) and a primary component metallization (21),
an insulation layer (40) directly or indirectly connected to the primary component metallization (21), and
a secondary component metallization (22) which is connected to the side of the insulation layer (40) facing away from the metal-ceramic substrate (1) and is especially isolated from the primary component metallization (21) using the insulation layer (40),
wherein the ceramic element (10) has a first size (L1, D1) and the insulation layer (40) has a second size (L2, D2) and a ratio of the second size (L2, D2) to the first size (L1, D1) has a value smaller than 0.8, to form an island-like insulation layer (40) on the primary component metallization (21).