Invention Grant
- Patent Title: Preformed solder-in-pin system
-
Application No.: US17873423Application Date: 2022-07-26
-
Publication No.: US12034263B2Publication Date: 2024-07-09
- Inventor: Dennis J. Johnson
- Applicant: Onanon, Inc.
- Applicant Address: US CA Milpitas
- Assignee: Onanon, Inc.
- Current Assignee: Onanon, Inc.
- Current Assignee Address: US CA Milpitas
- Agency: Neustel Law Offices
- Main IPC: H01R43/02
- IPC: H01R43/02 ; H01R4/02 ; H01R13/04 ; H01R24/86 ; H01R107/00

Abstract:
A method for inserting preformed solder members into connector pins for use with electrical connectors. The method generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are substantially eliminated. The method allows for inserting solder members in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that solder members can be inserted into large numbers of connector pins that are pre-installed in connector grommets, largely simultaneously.
Public/Granted literature
- US20220368095A1 Preformed Solder-in-Pin System Public/Granted day:2022-11-17
Information query