Invention Grant
- Patent Title: Create a protected layer for interconnects and devices in a packaged quantum structure
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Application No.: US17123350Application Date: 2020-12-16
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Publication No.: US12033981B2Publication Date: 2024-07-09
- Inventor: David Abraham , Oliver Dial , John Michael Cotte , Kevin Shawn Petrarca
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agent Erik Johnson
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L21/768 ; H01L23/06 ; H01L23/48 ; H01L25/00
Abstract:
A semiconductor device comprises a first chip layer, having a first chip layer front-side and a first chip layer back-side, a qubit chip layer, having a qubit chip layer front-side and a qubit chip layer back-side, the qubit chip layer front-side operatively coupled to the first chip layer front-side with a set of bump-bonds, a set of through-silicon vias (TSVs) connected to at least one of: the first chip layer back-side or the qubit chip layer back-side and a cap wafer metal bonded to at least one of: the qubit chip layer back-side or the first chip layer back-side.
Public/Granted literature
- US20220189922A1 CREATE A PROTECTED LAYER FOR INTERCONNECTS AND DEVICES IN A PACKAGED QUANTUM STRUCTURE Public/Granted day:2022-06-16
Information query
IPC分类:
