Invention Grant
- Patent Title: Wiring board, electronic device, and electronic module
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Application No.: US17605081Application Date: 2020-04-22
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Publication No.: US12028970B2Publication Date: 2024-07-02
- Inventor: Seiichirou Itou , Reika Nishiuchi
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Volpe Koenig
- Priority: JP 19081591 2019.04.23 JP 19081602 2019.04.23
- International Application: PCT/JP2020/017306 2020.04.22
- International Announcement: WO2020/218326A 2020.10.29
- Date entered country: 2021-10-20
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; G01P15/08 ; G01P15/18

Abstract:
Disclosed is a wiring board, including: a base body having insulating properties; and a wiring conductor positioned on the base body. The base body has a first surface, a fourth surface positioned opposite to the first surface, and a second surface and a third surface positioned at side surfaces between the first surface and the fourth surface. The first surface, the second surface, and the third surface are mounting surfaces for respective electronic components, and the fourth surface is an installation surface.
Public/Granted literature
- US20220192013A1 WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE Public/Granted day:2022-06-16
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