Invention Grant
- Patent Title: Dual-connectivity establishment method and device
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Application No.: US17122435Application Date: 2020-12-15
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Publication No.: US12028916B2Publication Date: 2024-07-02
- Inventor: Hong Wang , Lixiang Xu , Xiaowan Ke
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: CN 1710683643.4 2017.08.11
- Main IPC: H04W76/15
- IPC: H04W76/15 ; H04W28/02 ; H04W76/11 ; H04W76/12 ; H04W76/27 ; H04W80/08 ; H04W84/20

Abstract:
Embodiments of the present invention provide a dual-connectivity (DC) establishment method and device. The first DC architecture includes a Master Node (MN) and a Secondary Node (SN), wherein the SN includes a Central Unit (CU) and a Distributed Unit (DU); and, the CU includes a Control Plane functional entity (CP) and a User Plane functional entity (UP). The method includes steps of: receiving, by an SN-CP, a first SN setup request message transmitted by an MN; transmitting a first resource setup request message to an SN-UP according to the first SN setup request message, and receiving a first resource setup response message transmitted by the SN-UP; and, transmitting, by the SN-CP, a first bearer setup request message to an SN-DU, and receiving a first bearer setup response message transmitted by the SN-DU.
Public/Granted literature
- US20210100054A1 DUAL-CONNECTIVITY ESTABLISHMENT METHOD AND DEVICE Public/Granted day:2021-04-01
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