- Patent Title: Bonded body of copper and ceramic, insulating circuit substrate, bonded body of copper and ceramic production method, and insulating circuit substrate production method
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Application No.: US16960648Application Date: 2019-01-16
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Publication No.: US12027434B2Publication Date: 2024-07-02
- Inventor: Nobuyuki Terasaki
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JP 18010965 2018.01.25 JP 18227472 2018.12.04
- International Application: PCT/JP2019/001045 2019.01.16
- International Announcement: WO2019/146464A 2019.08.01
- Date entered country: 2020-07-08
- Main IPC: B32B15/20
- IPC: B32B15/20 ; B23K20/16 ; C04B37/02 ; H01L23/14 ; H01L23/373 ; B32B15/04

Abstract:
A bonded body of copper and ceramic includes: a copper member made of copper or a copper alloy and a ceramic member made of an aluminum oxide, the copper member and the ceramic member being bonded to each other; a magnesium oxide layer which is formed on a ceramic member side between the copper member and the ceramic member; and a Mg solid solution layer which is formed between the magnesium oxide layer and the copper member and contains Mg in a state of a solid solution in a Cu primary phase, in which one or more active metals selected from Ti, Zr, Nb, and Hf are present in the Mg solid solution layer.
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