Invention Grant
- Patent Title: Semiconductor package and method for making the same
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Application No.: US17885401Application Date: 2022-08-10
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Publication No.: US12027433B2Publication Date: 2024-07-02
- Inventor: Yang-Che Chen , Chen-Hua Lin , Huang-Wen Tseng , Victor Chiang Liang , Chwen-Ming Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: STUDEBAKER & BRACKETT PC
- Main IPC: H01L21/52
- IPC: H01L21/52 ; H01L23/00 ; H01L23/04 ; H01L23/06 ; H01L23/14 ; H01L23/498 ; H01L21/60
Abstract:
A semiconductor package includes a semiconductor chip disposed over a first main surface of a first substrate, a package lid disposed over the semiconductor chip, and spacers extending from the package lid through corresponding holes in the first substrate. The spacers enter the holes at a first main surface of the first substrate and extend beyond an opposing second main surface of the first substrate.
Public/Granted literature
- US20220384281A1 SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME Public/Granted day:2022-12-01
Information query
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