Invention Grant
- Patent Title: Package substrate and method of forming the same, package structure and method of forming the same
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Application No.: US17433789Application Date: 2020-11-12
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Publication No.: US12027379B2Publication Date: 2024-07-02
- Inventor: Ping-Heng Wu
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN 2010102444.1 2020.02.19
- International Application: PCT/CN2020/128342 2020.11.12
- International Announcement: WO2021/164337A 2021.08.26
- Date entered country: 2021-08-25
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/56 ; H01L23/13 ; H01L23/31 ; H01L23/00
Abstract:
The present disclosure relates to a package substrate comprising: a substrate having opposing first surface and second surface; at least one vent hole extending through the first surface and the second surface of the substrate, the vent hole comprising at least a long-strip hole.
Public/Granted literature
- US20220351984A1 PACKAGE SUBSTRATE AND METHOD OF FORMING THE SAME, PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2022-11-03
Information query
IPC分类:
