A method for thinning a fingerprint identification module includes the steps of: providing at least one fingerprint identification module, wherein the fingerprint identification module includes a glass substrate and a plurality of laminated fingerprint identification members; providing a protective layer on each laminated fingerprint identification member; providing a dissociable sealant around each laminated fingerprint identification member and the protective layer of the fingerprint identification module and being adhered to support plate to form a carrier plate to be etched; etching the carrier plate to be etched and allowing an etching solution to etch the glass substrate until a thickness to be thinned is etched to form a semi-finished carrier plate; dissociating the dissociable sealant of the semi-finished carrier plate to reduce its viscosity; and removing the support plate, the dissociable sealant and the protective layer to complete a finished product of the thinned fingerprint identification module.