Invention Grant
- Patent Title: Structure body, structure body manufacturing method, and electronic apparatus
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Application No.: US17413658Application Date: 2019-12-06
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Publication No.: US12023892B2Publication Date: 2024-07-02
- Inventor: Yuichi Takahashi , Shohei Abe , Gen Yonezawa , Takehito Shimatsu , Miyuki Uomoto
- Applicant: SONY GROUP CORPORATION , TOHOKU UNIVERSITY
- Applicant Address: JP Tokyo
- Assignee: Sony Group Corporation,Tohoku University
- Current Assignee: Sony Group Corporation,Tohoku University
- Current Assignee Address: JP Tokyo; JP Miyagi
- Agency: Sheridan Ross PC
- Priority: JP 19000662 2019.01.07
- International Application: PCT/JP2019/047879 2019.12.06
- International Announcement: WO2020/144992A 2020.07.16
- Date entered country: 2021-06-14
- Main IPC: B32B15/04
- IPC: B32B15/04 ; C03C27/04 ; C04B37/02 ; H01L33/50 ; F21S41/176 ; G03B21/20 ; H01L33/58

Abstract:
A structure body according to an embodiment of the present disclosure includes: a first base having one surface, and having a density lower than a density that is determined by a crystal structure and a composition of a constituent material; a second base disposed to face the one surface of the first base; and a buffer layer provided between the first base and the second base, and containing at least a metal element.
Public/Granted literature
- US20220055343A1 STRUCTURE BODY, STRUCTURE BODY MANUFACTURING METHOD, AND ELECTRONIC APPARATUS Public/Granted day:2022-02-24
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