Invention Grant
- Patent Title: Thermally decomposable build plate structure for stabilization of metal build surface during 3D printing and facile release of 3D printed objects
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Application No.: US18125965Application Date: 2023-03-24
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Publication No.: US12023735B2Publication Date: 2024-07-02
- Inventor: David P. Socha , Mark K. Olearczyk
- Applicant: INDIUM CORPORATION
- Applicant Address: US NY Utica
- Assignee: INDIUM CORPORATION
- Current Assignee: INDIUM CORPORATION
- Current Assignee Address: US NY Utica
- Agency: Sheppard, Mullin, Richter & Hampton LLP
- Main IPC: B22F12/30
- IPC: B22F12/30 ; B33Y30/00 ; B33Y40/00

Abstract:
Some implementations of the disclosure are directed to an additive manufacturing build plate structure for metal build surface stabilization during 3D printing and facile release of 3D printed objects. The build plate includes a body having a recessed section formed through a first surface of the body, the recessed section including a bottom surface within the body and sidewalls extending to the bottom surface. The recessed section is configured to be filled with a solid form of a metal or metal alloy that provides a printing surface for forming a 3D object in a 3D printing device. The recessed section includes a locking mechanism configured to prevent lift-up of the solid form of the metal or metal alloy during 3D printing in the 3D printing device.
Public/Granted literature
Information query