A printed wiring board includes an electrically insulating base film, and an electrically conductive pattern stacked on at least one surface side of the base film. An average width of multiple wiring portions included in the electrically conductive pattern is 5 μm or greater and 20 μm or less. Each of the wiring portions includes a seed layer and a plating layer. The plating layer includes copper crystal planes of a (111) plane, a (200) plane, a (220) plane, and a (311) plane. An intensity ratio IR220 of an X-ray diffraction intensity of the copper crystal plane (220) obtained by Equation (1) below is 0.05 or greater and 0.14 or less,

IR220=I220/(I111+I220+I311)  (1)

(where I111, I200, I220, I311 are respectively X-ray diffraction intensity of the (111) plane (200) plane, the (220) plane, and the (311) plane).