- Patent Title: Chip protective film and method for manufacturing same, and chip
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Application No.: US18459006Application Date: 2023-08-30
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Publication No.: US11978686B2Publication Date: 2024-05-07
- Inventor: De Wu , Shuhang Liao , Liu Zhang , Junxing Su
- Applicant: Wuhan Choice Technology Co, Ltd
- Applicant Address: CN Wuhan
- Assignee: Wuhan Choice Technology Co, Ltd.
- Current Assignee: Wuhan Choice Technology Co, Ltd.
- Current Assignee Address: CN Wuhan
- Agent Nitin Kaushik
- Priority: CN 2210784970.X 2022.07.06
- Main IPC: H01L23/29
- IPC: H01L23/29 ; H01L21/56

Abstract:
Disclosed are a chip protective film, a method for manufacturing the same, and a chip, which relate to the technical field of electronic chip protective films. The chip protective film includes: a first protective layer, and a second protective layer attached to at least a portion of a surface of the first protective layer. The second protective layer includes by mass: 90%-97% acrylate compounds; 0.1-5% fluorine-containing compounds; and a second adjuvant. The chip protective film features strong adhesion, low friction coefficient, high hardness, and good scratch resistance, which effectively solves the technical problem in the prior art that chip protective films are not scratch resistant.
Public/Granted literature
- US20240014085A1 CHIP PROTECTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND CHIP Public/Granted day:2024-01-11
Information query
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