Invention Grant
- Patent Title: Vacuum modulated two phase cooling loop performance enhancement
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Application No.: US17030141Application Date: 2020-09-23
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Publication No.: US11976671B2Publication Date: 2024-05-07
- Inventor: Paul Diglio , Pooya Tadayon , David Shia
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: B05C11/00
- IPC: B05C11/00 ; F04D29/58 ; C23C16/458 ; C23C16/46 ; H01L21/66

Abstract:
Embodiments disclosed herein include temperature control systems. In an embodiment, a temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature control system further comprises a vacuum source fluidically coupled to the spray chamber, where the vacuum source controls a pressure within the spray chamber, and where the fluid reservoir is between the vacuum source and the spray chamber.
Public/Granted literature
- US20210348624A1 VACUUM MODULATED TWO PHASE COOLING LOOP PERFORMANCE ENHANCEMENT Public/Granted day:2021-11-11
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