Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17847174Application Date: 2022-06-23
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Publication No.: US11949005B2Publication Date: 2024-04-02
- Inventor: Misaki Takahashi , Yuichi Harada , Kouta Yokoyama
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kanagawa
- Priority: JP 18024211 2018.02.14
- Main IPC: H01L29/73
- IPC: H01L29/73 ; H01L27/07 ; H01L29/739 ; H01L29/861 ; H03K17/0814 ; H03K17/567

Abstract:
Provided is a semiconductor device that includes a first conductivity type well region below a gate runner portion, wherein a diode region includes first contact portions, a first conductivity type anode region, and a second conductivity type cathode region; wherein the well region contacts the diode region in the first direction, and when an end of the well region, an end of at least one of first contact portions, and an end of the cathode region that face one another in the first direction are imaginary projected on an upper surface of the semiconductor substrate, a first distance is longer than a second distance, the first distance being a distance between the end of the well region and the end of the cathode region, and the second distance being a distance between the end of the well region and the end of the at least one first contact portion.
Public/Granted literature
- US20220328664A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-10-13
Information query
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