Invention Grant
- Patent Title: Source/drain structure for semiconductor device
-
Application No.: US17868462Application Date: 2022-07-19
-
Publication No.: US11948988B2Publication Date: 2024-04-02
- Inventor: Shahaji B. More , Cheng-Han Lee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L21/8234 ; H01L29/04 ; H01L29/66 ; H01L29/78

Abstract:
The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a gate structure over the substrate, and a source/drain (S/D) region adjacent to the gate structure. The S/D region can include first and second side surfaces separated from each other. The S/D region can further include top and bottom surfaces between the first and second side surfaces. A first separation between the top and bottom surfaces can be greater than a second separation between the first and second side surfaces.
Public/Granted literature
- US20220367649A1 Source/Drain Structure for Semiconductor Device Public/Granted day:2022-11-17
Information query
IPC分类: