Invention Grant
- Patent Title: Uneven-trench pixel cell and fabrication method
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Application No.: US17220695Application Date: 2021-04-01
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Publication No.: US11948965B2Publication Date: 2024-04-02
- Inventor: Hui Zang , Gang Chen
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: COZEN O'CONNOR
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L27/148 ; H01L29/423

Abstract:
An uneven-trench pixel cell includes a semiconductor substrate that includes a floating diffusion region, a photodiode region, and, between a front surface and a back surface: a first sidewall surface, a shallow bottom surface, a second sidewall surface, and a deep bottom surface. The first sidewall surface and a shallow bottom surface define a shallow trench, located between the floating diffusion region and the photodiode region, that extends into the semiconductor substrate from the front surface. A shallow depth of the shallow trench exceeds a junction depth of the floating diffusion region. The second sidewall surface and a deep bottom surface define a deep trench, located between the floating diffusion region and the photodiode region, that extends into the semiconductor substrate from the front surface. A distance between the deep bottom surface and the front surface defines a deep depth, of the deep trench, that exceeds the shallow depth.
Public/Granted literature
- US20220320175A1 UNEVEN-TRENCH PIXEL CELL AND FABRICATION METHOD Public/Granted day:2022-10-06
Information query
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