Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17465565Application Date: 2021-09-02
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Publication No.: US11948864B2Publication Date: 2024-04-02
- Inventor: Akira Yoshioka , Hung Hung , Yasuhiro Isobe , Toru Sugiyama , Hitoshi Kobayashi
- Applicant: KABUSHIKI KAISHA TOSHIBA , TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee: Kabushiki Kaisha Toshiba,Toshiba Electronic Devices & Storage Corporation
- Current Assignee Address: JP Tokyo; JP Tokyo
- Agency: Kim & Stewart LLP
- Priority: JP 21049303 2021.03.23
- Main IPC: H01L23/482
- IPC: H01L23/482 ; H01L29/20 ; H01L29/205 ; H01L29/778

Abstract:
A semiconductor device has a first wiring extending in a first direction on a nitride semiconductor layer. A source electrode is electrically connected to the first wiring and extends in a second direction. A drain electrode extends in the second direction and includes a first and second portion extending in the second direction, spaced from each other in the first direction. An element isolation region is in the second nitride semiconductor layer between the first and second portions. A third portion extends in the second direction on the first and second portions. A gate electrode extends in the second direction on the second nitride semiconductor layer between the source electrode and the drain electrode. The portion includes holes therein aligned with each other along the second direction with the spacing between adjacent holes in the second direction increasing with increasing distance in the second direction from the first wiring.
Public/Granted literature
- US20220310490A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-09-29
Information query
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