A mechatronic module includes: a hybrid circuit arrangement having at least one interrupter, which interrupter includes at least one first mechanical switch and at least one first semiconductor circuit arrangement. The hybrid circuit arrangement is situated on a first face of a ceramic substrate, a second face, opposite the first face, of the ceramic substrate being connected to a metal plate. A housing shell is fastened to the metal plate and encloses the ceramic substrate and the hybrid circuit arrangement. The metal plate and the housing shell form a housing of the mechatronic module. Interstices within the housing are filled at least in some regions with a potting compound.