Invention Grant
- Patent Title: Coordinating power transitions between a smart interconnect and heterogeneous components
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Application No.: US17395313Application Date: 2021-08-05
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Publication No.: US11947972B2Publication Date: 2024-04-02
- Inventor: Meng Yan , Omar Mahmoud Afdal Alnaggar , Myron O. Shak , Soheil Gharahi , William Kelsey
- Applicant: Shenzhen Chipuller Chip Technology Co., LTD
- Applicant Address: CN Shenzhen
- Assignee: Shenzhen Chipuller Chip Technology Co., LTD
- Current Assignee: Shenzhen Chipuller Chip Technology Co., LTD
- Current Assignee Address: CN Shenzhen
- Agency: MUGHAL GAUDRY & FRANKLIN PC
- Main IPC: G06F9/4401
- IPC: G06F9/4401 ; G06F1/24 ; G06F1/26 ; G06F9/445 ; G06F13/42 ; G06F21/57 ; G06F21/81
Abstract:
Described is an apparatus comprising a semiconductor interconnect substrate and an interface. The semiconductor interconnect substrate may be electrically coupled to one or more components mounted thereon. The interface may be operable to carry a configuration command set to the one or more components in a normal operation mode subsequent to a power-up mode.
Public/Granted literature
- US20210365273A1 COORDINATING POWER TRANSITIONS BETWEEN A SMART INTERCONNECT AND HETEROGENEOUS COMPONENTS Public/Granted day:2021-11-25
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