Invention Grant
- Patent Title: Semiconductor memory and method of manufacturing the same
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Application No.: US17381911Application Date: 2021-07-21
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Publication No.: US11937437B2Publication Date: 2024-03-19
- Inventor: Masahiro Kiyotoshi , Akihito Yamamoto , Yoshio Ozawa , Fumitaka Arai , Riichiro Shirota
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP 06256194 2006.09.21
- Main IPC: H10B63/00
- IPC: H10B63/00 ; H01L21/02 ; H01L21/28 ; H01L21/306 ; H01L21/3105 ; H01L21/321 ; H01L21/3213 ; H01L21/762 ; H01L27/105 ; H01L29/51 ; H10B43/27 ; H10B43/30 ; H10B43/35 ; H10B43/40 ; H10B69/00 ; H10B99/00 ; H10N70/00 ; H10N70/20

Abstract:
A semiconductor memory includes a plurality of stripe-like active areas formed by stacking, in a direction perpendicular to a substrate, a plurality of layers extending parallel to the substrate, a first gate electrode formed on first side surfaces of the active areas, the first side surfaces being perpendicular to the substrate, a second gate electrode formed on second side surfaces of the active areas, the second side surfaces being perpendicular to the substrate. The layers are patterned in self-alignment with each other, intersections of the active areas and the first gate electrode form a plurality of memory cells, and the plurality of memory cells in an intersecting plane share the first gate electrode.
Public/Granted literature
- US20210351235A1 SEMICONDUCTOR MEMORY AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-11-11
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