Invention Grant
- Patent Title: High frequency heating apparatus
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Application No.: US17251941Application Date: 2019-08-01
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Publication No.: US11937360B2Publication Date: 2024-03-19
- Inventor: Takashi Uno , Daisuke Hosokawa , Fumitaka Ogasawara , Mikio Fukui , Koji Yoshino , Yoshiharu Oomori
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 18146144 2018.08.02
- International Application: PCT/JP2019/030119 2019.08.01
- International Announcement: WO2020/027240A 2020.02.06
- Date entered country: 2020-12-14
- Main IPC: H05B6/62
- IPC: H05B6/62 ; H03H7/38 ; H05B6/50 ; H05B6/54

Abstract:
A high frequency heating apparatus (1A) includes the following components: a first electrode (11) that is flat; a plurality of flat second electrodes (12) that are flat; a high-frequency power supply (20); a matching unit (30); a controller (40); and an electric field regulator (50). The second electrodes (12) are placed opposite to the first electrode (11). The high-frequency power supply (20) applies a high-frequency voltage to the first electrode (11). The matching unit (30) is placed between the first electrode (11) and the high-frequency power supply (20), and is impedance-matched with the high-frequency power supply (20). The controller (40) controls the high-frequency power supply (20). The electric field regulator (50) individually adjusts the electric field strengths in a plurality of regions located between first electrode (11) and the second electrodes (12). This aspect can reduce uneven heating.
Public/Granted literature
- US20210267025A1 HIGH FREQUENCY HEATING APPARATUS Public/Granted day:2021-08-26
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